Semiconductor device and method for manufacturing same

A semiconductor device, comprising:

• a first semiconductor layer;
• a second semiconductor layer provided on and above the first semiconductor layer;
• a third semiconductor layer provided on and above the second semiconductor layer;
• a stacked body provided above the third semiconductor layer, the stacked body including a plurality of electrode layers stacked in a first direction;
• and
• a columnar portion including a fourth semiconductor layer and a first charge storage film, the fourth semiconductor layer extending through the stacked body, the third semiconductor layer and the second semiconductor layer, and reaches the first semiconductor layer in the first direction, and including a side wall portion in contact with the second semiconductor layer;
• a conductive layer extending through the stacked body and the third semiconductor layer in the first direction, extending in a second direction crossing the first direction, and having a first surface and a second surface opposing to the first surface in a third direction crossing the first direction and the second direction;
• a first insulating layer provided on the first surface of the conductive layer, and between the first surface and the stacked body;
• a second insulating layer provided on the second surface of the conductive layer, and between the second surface and the stacked body, wherein
• a lower end of the conductive layer protrudes lower than a lower end of the first insulating layer and a lower end of the second insulating layer.