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US 11,910,573 B2Granted
Mechanical device for cooling an electronic component
AssigneeMellanox Technologies, Ltd.
InventorsAlon Rokach, Ayal Shabtay, David Fischer, Nimer Hazin, Jamal Mousa
Life of this patent
Estimating the term…
Abstract
A mechanical device for cooling an electronic component may include a surface including an aperture, and a first support protruding from the surface and a second support protruding from the surface. In some embodiments, the device may include disposed within the aperture a thermal interface material (TIM).
Claims15
A mechanical device for cooling an electronic component, the device comprising:
- a surface comprising an aperture;
- and
- a first support protruding from the surface and a second support protruding from the surface;
- a thermal interface material (TIM) disposed within the aperture;
- wherein a height of the first support and a height of the second support are greater than a height of the electronic component such that when the device is placed on a Printed Circuit Board (PCB), a gap is formed between the surface of the device and the electronic component;
- wherein the gap between the surface of the device and the electronic component is smaller than the grain size of the TIM to prevent unintentional leak of the TIM onto the PCB upon application of the TIM within the aperture.
3 more elements
An electronic assembly comprising:
- a Printed Circuit Board (PCB);
- an electronic component connected to the PCB;
- a device comprising:
- a surface comprising an aperture aligned with the electronic component, and
- a first support protruding from the surface and a second support protruding from the surface and placed at their free ends on the PCB;
- and
- a thermal interface material (TIM) disposed within the aperture of the device;
- wherein the device is formed of a material having greater thermal conductivity than the PCB to cause heat to flow from the electronic component through the TIM to the device and dissipate from the device and the TIM to air or to a shell.
5 more elements
A method of assembling an electronic assembly, the method comprising:
- placing an electronic component on a Printed Circuit Board (PCB);
- providing a device comprising:
- a surface comprising an aperture configured to receive and hold in place a thermal interface material (TIM), and
- a first support protruding from the surface and a second support protruding from the surface,
- wherein a height of the first support and a height of the second support are greater than a height of the electronic component such that a gap is formed between the surface of the device and the electronic component;
- aligning the aperture in the surface of the device with the electronic component;
- and
- placing a free end of the first support and a free end of the second support of the device on the PCB;
- applying the TIM within the aperture of the device;
- wherein the gap between the surface of the device and the electronic component is smaller than the grain size of the TIM to prevent unintentional leak of the TIM onto the PCB upon application of the TIM within the aperture.
7 more elements
Dependencies are inferred from the claim text.