Sealed communications module with multi-path thermal management system

A communications module comprising:

• a housing having an interior and having a top wall, a bottom wall, and a side wall extending between the top wall and the bottom wall;
• a card carrying a circuit board assembly having one or more electronic components, the card positioned in the interior between the top and bottom walls and having an upper surface;
• and a thermal management system coupled to the upper surface of the card, wherein the thermal management system is configured to disperse heat away from the card toward the top wall and the side wall of the housing, thermal management system including:
• a first thermal pathway having a first end portion coupled to the upper surface of the card and a second end portion opposite the first end portion, wherein the first thermal pathway is configured to disperse heat in a first longitudinal plane;
• a second thermal pathway connected to the second end portion of the first thermal pathway, wherein the second thermal pathway is configured to disperse heat in a vertical plane;
• and a third thermal pathway connected to the second end portion of the first thermal pathway, wherein the third thermal pathway is configured to disperse heat in a second longitudinal plane;
• and the first thermal pathway comprises:
• a first heat spreader having a first surface attached to the upper surface of the card and a second surface opposite the first surface;
• an insulative layer at least partially covering the second surface of the first heat spreader, wherein the insulative layer at least partially blocks heat from dispersing out from an insulated portion of the second surface;
• a thermal pad attached to a portion of the second surface of the first heat spreader away from the insulative layer;
• one or more heat pipes extending a distance in a horizontal direction from the thermal pad to the transfer area, each of the one or more heat pipes having a first end portion in thermal communication with the thermal pad and a second end portion opposite the first end portion disperses the heat to a vertical plane which at least partially overlaps with a side wall of a housing;
• and a second heat spreader having a first portion in thermal communication with the thermal pad with the thermal pad between the first portion and the second surface of the first heat spreader, and a second portion opposite the first portion and coupled to the one or more heat pipe, wherein the second heat spreader at least partially covers an upper surface of the one or more heat pipes.

A thermal management system for a sealed communication module having an onboard card with at least one electronic component, the thermal management system comprising:

• an insulative layer having a bottom surface;
• a first heat spreader having a top surface wherein the bottom surface of the insulative layer is attached to a first portion of the top surface of the first heat spreader to obstruct a transfer of heat out of the top surface, a bottom surface of the first heat spreader being attached to an active surface of the onboard card;
• a thermal pad attached to a second portion of the top surface of the first heat spreader, wherein the first portion and the second portion do not overlap;
• and at least one heat pipe positioned above the insulative layer and the thermal pad, the at least one heat pipe having a first portion positioned above the thermal pad and a second portion extending across the insulative layer and having a distal end a first distance from an edge of the insulative layer;
• and the distal end disperses the heat to a vertical plane which at least partially overlaps with a side wall of a housing.