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US 11,910,568 B2Granted
Heat dissipation system with microelectromechanical system (MEMS) for cooling electronic or photonic components
AssigneeCisco Technology, Inc.
InventorJoel Richard Goergen
Life of this patent
Estimating the term…
Abstract
In one or more embodiments, an apparatus includes a substrate and die package, a thermal transfer plate positioned adjacent to the substrate and die package for cooling the substrate and die package, wherein at least one electrical path extends through the thermal transfer plate for transmitting power from a power module to the substrate and die package, and a microelectromechanical system (MEMS) module comprising a plurality of air movement cells for dissipating heat from the thermal transfer plate.
Claims28
An apparatus comprising:
- a substrate and die package;
- a thermal transfer plate positioned adjacent to the substrate and die package for cooling the substrate and die package, wherein at least one electrical path extends through a first surface of the thermal transfer plate to a second surface of the thermal transfer plate for transmitting power from a power module to the substrate and die package, and wherein at least one optical path extends through the substrate and die package, and extends from the first surface of the thermal transfer plate to the second surface of the thermal transfer plate;
- and
- a microelectromechanical system (MEMS) module comprising a plurality of air movement cells for dissipating heat from the thermal transfer plate.
1 more element
An apparatus comprising:
- a substrate and die package comprising at least one electronic integrated circuit and at least one photonic integrated circuit;
- and
- a heat dissipation system for dissipating heat from the substrate and die package comprising:
- a vapor chamber;
- heat sink fins coupled to the vapor chamber;
- and
- a microelectromechanical system (MEMS) module comprising a plurality of air movement cells operable to push air over the heat sink fins;
- wherein the heat dissipation system comprises at least one electrical path for transmitting power or an electrical signal to the at least one electronic integrated circuit and at least one optical path for transmitting an optical signal to the at least one photonic integrated circuit, wherein the at least one electrical path extends through a first surface of the heat dissipation system to a second surface of the heat dissipation system, and wherein the at least one optical path extends through the substrate and die package, and extends from the first surface the heat dissipation system to the second surface of the heat dissipation system.
5 more elements
An apparatus comprising:
- a thermal transfer plate configured for dissipating heat from an electronic component or a photonic component associated with a substrate and die package;
- a heat transfer element coupled to the thermal transfer plate;
- and
- a microelectromechanical system (MEMS) module comprising a plurality of air movement cells operable to push air over the heat transfer element;
- wherein the thermal transfer plate comprises at least one path for transmitting power to the electronic component, and at least one path for an optical signal to the photonic component, wherein the at least one path for transmitting power extends through a first surface of the thermal transfer plate to a second surface of the thermal transfer plate, and wherein the at least one path for the optical signal extends through the substrate and die package, and extends from the first surface of the thermal transfer plate to the second surface of the thermal transfer plate.
2 more elements
Dependencies are inferred from the claim text.