Transportable datacenter

A method of assembling a transportable datacenter, including:

• providing a housing, wherein the housing includes:
• one or more air intake openings for receiving air from an external environment, the one or more air intake openings on a first sidewall;
• and
• one or more air exhaust openings for exhausting air to the external environment, the one or more air exhaust openings are on a second sidewall opposing the first sidewall,
• installing a plurality of racks in the transportable datacenter, each rack having a plurality of processor bays for receiving a plurality of processor devices, each processor bay in the plurality of processor bays having a front face and a rear face, wherein at least some of the racks are arranged in pairs, and the pairs include a first pair having a first rack and a second rack;
• arranging the racks in at least some of the pairs of racks in a v-shaped configuration in a horizontal direction to reduce turbulence in the air flow through pairs of racks arranged in the v-shaped configuration;
• installing a ventilation system that generates an air flow progressively through the one or more air intake openings, a cold air plenum, the processor bays, one or more hot air plenum and the one or more air exhaust openings;
• and
• wherein each of the plurality of racks comprises a plurality of shelves, each shelf in the plurality of shelves having at least two horizontally arranged processor bays in the plurality of processor bays,
• wherein the front faces of the processor bays are adjacent the cold air plenum and the rear faces of the processor bays are adjacent the one or more hot air plenums, the cold air plenum between the one or more air intake openings and the front faces of the plurality of processor bays, each of the one or more hot air plenums between the rear faces of the processor bays and the air exhaust opening.