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US 11,910,538 B2Granted
Electronic device housings with patterned electrolytic plating layers
AssigneeHewlett-Packard Development Company, L.P.
InventorsYi-Chen Chen, Kun Cheng Tsai, Kuan-Ting Wu, Ying-Hung Ku, Hsueh Chen Hung
Life of this patent
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Abstract
In one example, an electronic device housing may include a substrate, an insulating adhesive layer formed on a surface of the substrate, a patterned electroless plating layer formed on the insulating adhesive layer, and a patterned electrolytic plating layer formed on the patterned electroless plating layer.
Claims11
An electronic device, comprising:
- a first circuit board;
- a second circuit board;
- a housing to house the first circuit board and the second circuit board;
- an insulating adhesive layer formed on a surface of the housing;
- a patterned electroconductive layer formed on the insulating adhesive layer to electrically connect the first circuit board and the second circuit board, wherein the patterned electroconductive layer comprises:
- a patterned electroless plating layer formed on the insulating adhesive layer;
- and
- a patterned electrolytic plating layer formed on the patterned electroless plating layer;
- a first contact pad formed on the insulating adhesive layer and connected to a first end of the patterned electroconductive layer;
- a second contact pad formed on the insulating adhesive layer and connected to a second end of the patterned electroconductive layer, wherein the first contact pad is electrically connected to the second contact pad using the patterned electroconductive layer;
- a first surface contact connector having a first end connected to the first circuit board via a first spring and a second end physically engaged with the first contact pad;
- and
- a second surface contact connector having a first end connected to the second circuit board via a second spring and a second end physically engaged with the second contact pad.
10 more elements
A method for manufacturing a casing of an electronic device, comprising:
- forming an insulating adhesive layer on a surface of a substrate;
- forming an electroconductive layer on the insulating adhesive layer, wherein forming the electroconductive layer comprises:
- forming an electroless copper plating layer on the insulating adhesive layer;
- and
- forming an electrolytic copper plating layer on the electroless copper plating layer;
- and
- applying a lithographic patterning process on the electroconductive layer to form a circuit having a pattern, wherein applying the lithographic patterning process on the electroconductive layer comprises:
- forming a photoresist layer on a surface of the electroconductive layer;
- aligning and exposing the photoresist layer to at least one of an infrared radiation and an ultraviolet radiation;
- developing the photoresist layer to form a patterned photoresist layer;
- etching the electroconductive layer, while using the patterned photoresist layer as a mask, to form the circuit with the pattern;
- and
- removing the patterned photoresist layer from the surface of the electroconductive layer.
10 more elements
A method for manufacturing a casing of an electronic device comprising:
- forming an insulating adhesive layer on a surface of a substrate;
- forming an electroconductive layer on the insulating adhesive layer, wherein forming the electroconductive layer comprises:
- forming an electroless copper plating layer on the insulating adhesive layer;
- and
- forming an electrolytic copper plating layer on the electroless copper plating layer;
- and
- applying a lithographic patterning process on the electroconductive layer to form a circuit having a pattern;
- wherein forming the insulating adhesive layer on the surface of the substrate comprises:
- applying the insulating adhesive layer with a release film on the surface of the substrate;
- treating the substrate with an anti-fingerprint coating composition upon applying the insulating adhesive layer with the release film;
- and
- removing the release film.
9 more elements
A method for manufacturing a casing of an electronic device, comprising:
- forming an insulating adhesive layer on a surface of a substrate;
- forming an electroconductive layer on the insulating adhesive layer, wherein forming the electroconductive layer comprises:
- forming an electroless copper plating layer on the insulating adhesive layer;
- and
- forming an electrolytic copper plating layer on the electroless copper plating layer;
- applying a lithographic patterning process on the electroconductive layer to form a circuit having a pattern;
- and
- treating the insulating adhesive layer by applying a plasma treatment and a subsequent ultraviolet treatment prior to forming the electroconductive layer on the insulating adhesive layer.
5 more elements
Dependencies are inferred from the claim text.