Direct-ink-writing method for printing strain gauge array circuit based on insulating strips

A direct-ink-writing (DIW) method for printing a strain gauge array circuit based on insulating strips, the method comprising:

• forming a first insulating layer by DIW printing on a planar substrate using an insulating material;
• forming m parallel spaced first silver lines by DIW printing on the insulating layer using conductive silver paste to form a first circuit layer, wherein one end of each first silver line comprises an electrode lead-out end;
• forming n parallel spaced insulating strips by DIW printing on the first circuit layer using an insulating material to form a second insulating layer, wherein the insulating strips are perpendicular to the first silver lines and continuously cover m first silver lines in a region where the insulating strips are located, and the first silver lines in a region between two adjacent insulating strips are exposed with respect to the second insulating layer;
• respectively printing a second silver line at each insulating strip of the second insulating layer using the conductive silver paste to form a second circuit layer, wherein each second silver line respectively comprises a main line and m branches connected thereto, and each second silver line is respectively spaced apart;
• a main line of each second silver line is respectively located on the corresponding insulating strip, is perpendicular to the first silver line, and has one end comprising an electrode lead-out end;
• a part of each branch of the second silver line is located on the corresponding insulating strip, and the other part of each branch is outside the insulating strip and located on the first insulating layer;
• forming m*n strain gauge head electrodes, m*n strain gauge tail electrodes, and m*n connecting wires by DIW printing using conductive carbon paste to form a functional layer, wherein one strain gauge head electrode is respectively printed at a region of each first silver line that is exposed between two adjacent insulating strips and a region that is exposed between the electrode lead-out end and the adjacent insulating strip;
• one strain gauge tail electrode is respectively printed at the tail end of each branch of each second silver line on the second circuit layer;
• each strain gauge head electrode corresponds to one strain gauge tail electrode and is connected to the strain gauge tail electrode through a connecting wire;
• printing and forming a third insulating layer using an insulating material to complete encapsulation, wherein the third insulating layer covers other regions except the electrode lead-out ends of the first circuit layer, the electrode lead-out ends of the second circuit layer, and the strain gauge head electrodes and the strain gauge tail electrodes on the functional layer.