Method for manufacturing electronics assembly and electronics assembly

A method for manufacturing an electronics assembly, the method comprising:

• obtaining or producing an electronics module, wherein the electronics module comprises:
• a first circuitry on a first surface at a first side of a circuit board,
• at least one electronics component on the circuit board and in electrical connection with the first circuitry, and
• at least one first connection portion on an adjacent side surface relative to the first surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is at least one of electrically connected to or comprised in the first circuitry;
• arranging the electronics module on a second substrate including a thermoformable film or sheet comprising a second connection portion connected to a second circuitry on a surface of the second substrate, wherein the second connection portion is spaced-apart from the at least one first connection portion, wherein a second surface of the circuit board, being on the opposite second side than the first surface, faces the second substrate,
• arranging, subsequent to said arranging of the electronics module on the second substrate, electrically conductive joint material onto the at least one first connection portion and the second connection portion such that the electrically conductive joint material extends from the at least one first connection portion to the second connection portion to connect the at least one first connection portion to the second connection portion for electrically connecting the electronics module to the second circuitry via the electrically conductive joint material, the electrically conductive joint material including melted or stencil printed solder material, conductive adhesive, or conductive ink, wherein the melted or stencil printed solder material, the conductive adhesive, or the conductive ink, extends from the at least one first connection portion to the second connection portion, and
• arranging a third substrate comprising at least one of a thermoformable film or sheet on the opposite side of the electronics module relative to the second substrate, wherein the at least one electronics component comprises a segment display and wherein the third substrate is attached to a surface of the segment display being on the opposite side of the segment display than the circuit board.