Substrate with electronic component embedded therein
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSong I Kim, Mi Sun Hwang
Life of this patent
Estimating the term…
Abstract
A substrate with an electronic component embedded therein includes: a core layer having a through-portion; an electronic component disposed in the through-portion; an encapsulant disposed on a lower surface of the core layer, disposed in at least a portion of the through-portion, and covering at least a portion of a lower surface of the electronic component; and a build-up structure disposed on an upper surface of the core layer, and including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers.
Claims21
A substrate with an electronic component embedded therein, comprising:
- a core layer having a through-portion;
- the electronic component disposed in the through-portion;
- an encapsulant disposed on a lower surface of the core layer, disposed in at least a portion of the through-portion, and covering at least a portion of a lower surface of the electronic component;
- a build-up structure disposed on an upper surface of the core layer, and including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers;
- and
- a first wiring via connecting at least a portion of a first wiring layer, as one of the plurality of wiring layers, to the electronic component,
- wherein the first wiring via penetrates through one of the plurality of insulating layers and at least a portion of the encapsulant,
- a via, among the plurality of via layers, penetrates through the one of the plurality of insulating layers and has a shape tapered in a direction, opposite to the first wiring via, and
- another of the plurality of insulating layers is in contact with the core layer.
A substrate with an electronic component embedded therein, comprising:
- a core layer having a through-portion;
- the electronic component disposed in the through-portion;
- an encapsulant embedding at least a portion of the electronic component;
- and
- a build-up structure disposed on the core layer, and including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers,
- wherein a via of a first via layer as one of the plurality of via layers, and a via of a second via layer as another one of the plurality of via layers, penetrate through a same one of the plurality of insulating layers and have a shape tapered in directions opposite to each other,
- the via of the first via layer penetrates at least a portion of the encapsulant, and
- another of the plurality of insulating layers is in contact with the core layer.
A substrate with an electronic component embedded therein, comprising:
- a core layer having a through-portion;
- the electronic component disposed in the through-portion and including a connection pad disposed on a first surface of the electronic component;
- an encapsulant extending to cover at least a portion of the first surface and at least a portion of a second surface of the electronic component opposing the first surface;
- and
- a build-up structure disposed on a surface of the core layer, and including a plurality of first insulating layers, a plurality of first wiring layers, and a plurality of first via layers,
- wherein one via of the plurality of first via layers and another via of the plurality of first via layers penetrate through a same one of the plurality of first insulating layers and have a shape tapered in directions opposite to each other,
- the one via of the plurality of first via layers penetrates at least a portion of the encapsulant, and
- another of the plurality of first insulating layers is in contact with the core layer.
Dependencies are inferred from the claim text.