Power device assemblies having embedded PCBS and enhanced cooling and methods of fabricating the same
AssigneeToyota Motor Engineering & Manufacturing North America, Inc.
InventorsFeng Zhou, Ercan Dede, Hiroshi Ukegawa
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Abstract
Disclosed herein are apparatus and methods for a power electronics assembly that includes a printed circuit board (PCB) and an electrical insulation portion. The PCB includes a plurality of embedded power devices and a substrate layer having a plurality of metal inverse opal (MIO) portions. The electrically insulating portion is positioned between each of the MIO portions. The plurality of MIO portions is thermally coupled to the plurality of embedded power devices.
Claims20
A power electronics assembly comprising:
- a printed circuit board (PCB) comprising:
- a plurality of embedded power devices;
- and
- a substrate layer comprising a plurality of metal inverse opal (MIO) portions;
- and
- an electrically insulating portion disposed between each of the plurality of MIO portions, the plurality of MIO portions being thermally coupled to the plurality of embedded power devices.
A method for fabricating a power electronics assembly, the method comprising:
- forming an electrical insulation layer on a substrate layer of a printed circuit board (PCB), the electrical insulation layer defining a plurality of cavities;
- depositing a metal inverse material (MIO) template into each of the plurality of cavities;
- depositing MIO material into each MIO template;
- and
- removing the MIO templates, thereby forming a plurality of MIO portions, each being thermally coupled to an embedded device of a plurality of embedded devices of the PCB.
A method for fabricating a power electronics assembly, the method comprising:
- forming an electrical insulation layer having a plurality of cavities onto a printed circuit board (PCB);
- placing a frame onto the PCB;
- depositing a metal inverse material (MIO) template into each of the plurality of cavities;
- depositing MIO material into the MIO template;
- and
- removing the frame and the MIO template, thereby forming a plurality of MIO portions, each being thermally coupled to an embedded device of a plurality of embedded devices of the PCB.
Dependencies are inferred from the claim text.