Thermal management in circuit board assemblies

A method comprising:

• providing a printed circuit board (PCB) defined upon a substrate and having one or more vias extending through the substrate between a first face and a second face, walls of the one or more vias having a coating thereon;
• filling the one or more vias with a metal nanoparticle paste composition comprising a) metal nanoparticles coated with one or more surfactants, b) one or more organic solvents, and c) about 10 wt. % to about 35 wt. % micron-scale particles and that is adapted to limit shrinkage during metal nanoparticle consolidation;
• and
• consolidating metal nanoparticles of the metal nanoparticle paste composition within the one or more vias to form a monolithic metal body filling each of the one or more vias and contacting the coating therein, the monolithic metal body in each via having a uniform nanoporosity ranging from about 2% to about 30%.