Method and apparatus for heat sink mounting
AssigneeHuawei Technologies Canada Co., Ltd.
InventorMatthew Milyavsky
Life of this patent
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Abstract
A method is disclosed of mounting a heat sink through a printed circuit board to reach a component on the opposite side of a board. The heat sink is passed through a window in the board to contact a component at a predetermined pressure optimized for thermal performance at minimum stress. The heat sink is affixed in place on the printed circuit board using through-hole pins which can be soldered to maintain the heat sink's position and the predetermined pressure.
Claims17
A method of mounting to a substrate a heat sink member in contact with a first component residing on the substrate, the substrate comprising a first surface and a second surface substantially parallel to the first surface, the first component residing on the first surface of the substrate, the method comprising:
- inserting mounting pins of the heat sink member coaxially into pin receiving openings of the second surface of the substrate, the axes of the mounting pins and the receiving openings oriented in a first direction;
- bringing a contact surface of the heat sink member into contact with the first component at a first pressure, wherein the first pressure is a predetermined pressure selected to enhance heat transfer characteristics of a thermal interface material interposed between the first component and the heat sink member and wherein displacement of the heat sink member in the first direction is determined based on the first pressure;
- and
- rigidly affixing the mounting pins inside the receiving openings such that contact between the first component and the heat sink member at the first pressure is maintained,
- wherein the heat sink member is a first heat sink comprising one contiguous metal body and the mounting pins are integral to the contiguous metal body.
A circuit board comprising:
- a substrate comprising a first surface and a second surface substantially parallel to the first surface;
- an integrated circuit residing on the first surface of the substrate and joined electrically to the first surface of the substrate;
- a contiguous metal body, a contact interface surface of the contiguous metal body contacting the integrated circuit at a first pressure via a thermal interface material along the contact interface surface;
- pins, comprising a first pin oriented along a first direction, disposed inside pin receiving openings through the second surface of the substrate, the pins being integral to the contiguous metal body;
- wherein the first pressure is a predetermined pressure selected to enhance heat transfer characteristics of the thermal interface material;
- wherein the extent of an incursion of the contiguous metal body in the first direction is determined based on the first pressure;
- and
- wherein the pins are rigidly affixed into the pin receiving openings to maintain the contiguous metal body in contact with the integrated circuit via the thermal interface material at the first pressure.
Dependencies are inferred from the claim text.