Electronic device including heat dissipation structure

An electronic device comprising:

• a first printed circuit board arranged in a first direction;
• a first thermal diffusion member including at least one of a heat pipe or a vapor chamber and arranged in parallel to the first printed circuit board;
• a second printed circuit board arranged in a second direction substantially perpendicular to the first direction to be separated from the first printed circuit board and electrically connected to the first printed circuit board;
• and
• a heat transfer member including
• at least one partial area arranged to face the first thermal diffusion member and
• at least one other partial area arranged to face one surface of the second printed circuit board,
• wherein the at least one other partial area of the heat transfer member is bent from the at least one partial area of the heat transfer member.