US 11,910,155 B2Granted

MEMS speaker

AssigneeAAC Kaital Technologies (Wuhan) CO., LTD

InventorsQiang Dan, Yiwei Zhou, Yu Shen, Yang Li

Life of this patent

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Abstract

The present disclosure discloses a MEMS speaker including a housing with a receiving space; a MEMS speaker chip with an inner cavity, accommodated in the receiving space and connected with the housing, the MEMS speaker chip dividing the receiving space into a first cavity and a second cavity communicating with the inner cavity; a sound hole communicating with the first cavity or the second cavity; and a damping mesh connected to the housing and covering the sound hole; wherein sounds emitted by the MEMS speaker chip transmit outward through the sound hole and the damping mesh. Compared with the related art, MEMS speaker disclosed by the present disclosure has a better reliability.

Claims9

Dependent claims

A MEMS speaker, comprising:

a housing with a receiving space;
and
a MEMS speaker chip with an inner cavity, accommodated in the receiving space and connected with the housing, the MEMS speaker chip dividing the receiving space into a first cavity and a second cavity communicating with the inner cavity;
wherein
the housing includes a printed circuit board connected with the MEMS speaker chip and a shell assembled with the printed circuit board for forming the receiving space, the shell and the MEMS speaker chip form the first cavity, the printed circuit board and the MEMS speaker chip form the second cavity, a sound hole is formed on the shell and communicating with the first cavity, a damping mesh is attached to the shell and covering the sound hole, sounds emitted by the MEMS speaker chip transmit outward through the sound hole and the damping mesh.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application: 17/879,756Filed 2 Aug 2022
Priority: CN 202220453634.23 Mar 2022
Published: US 2023/0283947 A17 Sep 2023
Granted: 20 Feb 2024
Term ends: Not estimatedThe source records don’t support an estimate.

Classification9 codes

H04R 1/288
By means of damping material, e.g. as cladding: for loudspeaker transducers
H04R 19/005
Electrostatic transducers: using semiconductor materials
H04R 1/023
Casings; Cabinets ; Supports therefor; Mountings therein: screens for loudspeakers
H04R 1/025
Casings; Cabinets ; Supports therefor; Mountings therein: arrangements for fixing loudspeaker transducers, e.g. in a box, furniture

Family

US 2023/0283947 A1Pre-grant publication · published 7 Sep 2023
US 11,910,155 B2This patent

From the US filing history. Foreign family members aren’t listed.

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