MEMS microphone and package with integrated passive acoustic filter, extended soundport

A MEMS device comprising:

• a package for providing an inner volume wherein the package comprises a substrate structure and a lid structure;
• a MEMS microphone arranged in the inner volume;
• a sound port through the package to the inner volume;
• and
• a passive acoustic attenuation filter acoustically coupled to the sound port, wherein the passive acoustic attenuation filter comprises a tube element branching off from the sound port,
• wherein the sound port extends through the lid structure, and
• wherein the passive acoustic attenuation filter is integrated into the lid structure, including the tube structure.

A method for operating MEMS devices, the method comprising:

• receiving sound waves at a sound port of a MEMS device formed as a package having an inner volume, a MEMS microphone located in the inner volume, the sound port extending through the package to the inner volume, and a passive acoustic attenuation filter acoustically coupled to the sound port, wherein the sound waves include at least some frequencies of a frequency range;
• enabling the sound waves to be acoustically coupled by a tube element branching off from the sound port comprising the passive acoustic attenuation filter, wherein the sound port and the tube structure are integrated into a substrate portion of the MEMS device, wherein the tube element has a tube inlet acoustically coupled to the sound port, the tube inlet corresponding to a cross-sectional area of the tube having a width, and wherein the width is substantially smaller than a length of the tube element;
• and
• based on the length and the width of the tube structure being associated with the frequency range, enabling at least some of the sound waves in the frequency range to be attenuated by the tube structure before the sound waves are received by the MEMS microphone.