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US 11,909,379 B2Granted
MEMS device having a connection portion formed of a eutectic alloy
AssigneeMurata Manufacturing Co., Ltd.
InventorsYoshihisa Inoue, Masakazu Fukumitsu, Yuichi Goto
Life of this patent
Estimating the term…
Abstract
A MEMS device that includes a substrate including an element and a connection wiring electrically connected to the element, and a connection portion electrically connected to the connection wiring. The connection portion is formed of a eutectic alloy of a first metal and a second metal. A line width of the connection wiring is smaller than a width of the connection portion when a main surface of the substrate is viewed in a plan view.
Claims19
A MEMS device, comprising:
- a substrate including an element and a connection wiring electrically connected to the element;
- and
- a connection portion electrically connected to the connection wiring and formed of a eutectic alloy of a first metal and a second metal,
- wherein a width of the connection wiring is smaller than a width of the connection portion when a main surface of the substrate is viewed in a plan view of the substrate,
- wherein the substrate further includes a contact electrode that electrically connects the connection wiring and the element,
- wherein a length of the connection wiring from the connection portion to the contact electrode is five times or more of a linear distance between the connection portion and the contact electrode in the plan view, and
- wherein the connection wiring further includes an electrode pad between the connection portion and the element in the plan view.
4 more elements
A MEMS device, comprising:
- a substrate including an element and a connection wiring electrically connected to the element;
- and
- a connection portion electrically connected to the connection wiring and formed of a eutectic alloy of a first metal and a second metal,
- wherein a width of the connection wiring is smaller than a width of the connection portion when a main surface of the substrate is viewed in a plan view of the substrate,
- wherein the substrate further includes a contact electrode that electrically connects the connection wiring and the element,
- wherein a length of the connection wiring from the connection portion to the contact electrode is three times or more of the width of the connection wiring in the plan view, and
- wherein the connection wiring further includes an electrode pad between the connection portion and the element in the plan view.
4 more elements
A MEMS device, comprising:
- a substrate including an element and a connection wiring electrically connected to the element;
- and
- a connection portion electrically connected to the connection wiring and formed of a eutectic alloy of a first metal and a second metal,
- wherein a width of the connection wiring is smaller than a width of the connection portion when a main surface of the substrate is viewed in a plan view of the substrate, and
- wherein the connection wiring further includes an electrode pad between the connection portion and the element in the plan view.
2 more elements
Dependencies are inferred from the claim text.