US 11,909,099 B2Granted

Antenna module

AssigneeSamsung Electronics Co., Ltd.

InventorsWon Wook So, Jin Seon Park, Young Sik Hur, Jung Chul Gong, Yong Ho Baek

Life of this patent

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Abstract

An antenna module includes an antenna substrate including an antenna pattern; a semiconductor package disposed on a lower surface of the antenna substrate, electrically connected to the antenna substrate, and having a semiconductor chip embedded therein; and an electronic component disposed at a side of the antenna substrate, electrically connected to the antenna substrate, and spaced apart from the semiconductor package by a predetermined distance. The antenna module includes a connection substrate connected to a portion of the antenna substrate, the connection substrate having an extension portion extending outward from the side of the antenna substrate, and the electronic component is disposed on the extension portion of the connection substrate to electrically connect to an inner wiring layer of the antenna substrate.

Claims20

Dependent claims

An antenna module comprising:

an antenna substrate including an antenna pattern;
a semiconductor package disposed on a lower surface of the antenna substrate, electrically connected to the antenna substrate, and having at least one semiconductor chip embedded therein;
and
an electronic component disposed at a side of the antenna substrate, electrically connected to the antenna substrate, and spaced apart from the semiconductor package by a predetermined distance,
wherein the antenna module further comprises a connection substrate connected to a portion of the antenna substrate, the connection substrate having an extension portion extending outward from the side of the antenna substrate, and
the electronic component is disposed on the extension portion of the connection substrate to electrically connect to an inner wiring layer of the antenna substrate,
wherein the semiconductor package includes a frame having a first through-hole, a first semiconductor chip of the at least one semiconductor chip disposed in the first through-hole and having a first active surface having first connection pads disposed thereon, an encapsulant covering the first semiconductor chip and filling the first through-hole, and a connection structure disposed on the frame and the first active surface of the first semiconductor chip and including redistribution layers electrically connected to the first connection pads.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 17/517,874Filed 3 Nov 2021 · continuation
Priority: KR 10-2018-008311817 Jul 2018
Published: US 2022/0059926 A124 Feb 2022
Granted: 20 Feb 2024
Term ends: Not estimatedThe source records don’t support an estimate.

Classification21 codes

H01Q 1/2283
By structural association with other equipment or articles: mounted in or on the surface of a semiconductor substrate as a chip-type antenna or…
H01Q 1/243
Specially adapted for hand-held use: with built-in antennas
H01Q 9/0407
Resonant antennas: substantially flat resonant element parallel to ground plane, e.g. patch antenna
H01Q 21/08
Arrays of individually energised antenna units similarly polarised and spaced apart: the units being spaced along or adjacent to a rectilinear path

Family

Application16/291,594Parent of this continuation · filed 4 Mar 2019
US 2022/0059926 A1Pre-grant publication · published 24 Feb 2022
US 11,177,551 B2Parent of this continuation
US 2020/0028239 A1Published application
US 11,909,099 B2This patent

From the US filing history. Foreign family members aren’t listed.

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