Semiconductor package, method of bonding workpieces and method of manufacturing semiconductor package

A semiconductor package, comprising:

• a first semiconductor device comprising a first alignment pattern having a plurality of first scale patterns separated from one another and arranged in a first direction;
• and
• a second semiconductor device mounted over the first semiconductor device and comprising a second alignment pattern having a plurality of second scale patterns separated from one another and arranged in a second direction parallel to the first direction, and a scale pitch of the first scale patterns is different from a scale pitch of the second scale patterns.

A semiconductor package, comprising:

• a first semiconductor device comprising a first alignment pattern having a plurality of first scale patterns arranged in a first direction;
• and
• a second semiconductor device mounted over the first semiconductor device and comprising a second alignment pattern having a plurality of second scale patterns arranged in a second direction parallel to the first direction, wherein a length of (n−1) scale pitches of the second scale patterns is equal to a length of (n) scale pitches of the first scale patterns.