Contaminant control in thermocompression bonding of semiconductors and associated systems and methods

A method for inhibiting vaporized bonding material from entering a vacuum system, the method comprising:

• withdrawing air, via a first flow unit, from a first port of a bondhead having a first side and a second side spaced at a distance from the first side and defining a thickness of the bondhead, wherein the first port is fluidly coupled to a first channel of the bondhead extending in a lateral direction from the port along the second side toward a perimeter of the bondhead, the first channel forming an elongate opening in the second side of the bondhead;
• and
• withdrawing air, via a second flow unit, from a second port, wherein the second port is fluidly coupled to a second conduit positioned laterally outward from the first channel such that contaminants flow into the second conduit,
• wherein the second conduit is a vacuum manifold separate from and disposed around the bondhead, the vacuum manifold having a portion extending along and spaced apart from a side of the bondhead and positioned laterally outward from the perimeter of the bondhead, the second conduit having a second vacuum opening positioned laterally outward from the bondhead.