Semiconductor die stack having bent wires and vertical wires and a semiconductor package including the semiconductor die stack

A semiconductor package comprising a semiconductor die stack, the semiconductor die stack including:

• a lower semiconductor die including first and second lower pads, and an upper semiconductor die including first and second upper pads stacked on the lower semiconductor die;
• a first bent wire electrically connecting the first lower pad with the first upper pad in a first direction;
• a second bent wire electrically connecting the second lower pad with the second upper pad in the first direction;
• a first vertical wire disposed on any one of the first lower pad and the first upper pad;
• and
• a second vertical wire disposed on any one of the second lower pad and the second upper pad,
• wherein the first lower pad and the first upper pad are aligned in the first direction;
• wherein the second lower pad and the second upper pad are aligned in the first direction;
• wherein the first lower pad and the second lower pad are aligned in a second direction, the second direction being perpendicular to the first direction;
• wherein the first upper pad and the second upper pad are aligned in the second direction;
• and
• wherein the first vertical wire and the second vertical wire are arranged in a diagonal direction with respect to the first and second directions.

A semiconductor package comprising a semiconductor die stack, the semiconductor die stack including:

• a lower semiconductor die and an upper semiconductor die which are stacked in a staircase form in a first direction;
• and
• metal pillars,
• wherein the lower semiconductor die includes a plurality of lower pads arranged in a second direction, the second direction being perpendicular to the first direction, and
• wherein the upper semiconductor die includes a plurality of upper pads arranged in the second direction;
• wherein bent wires electrically connect at least one of the lower pads of the lower semiconductor die to at least one of the upper pads of the upper semiconductor die in the first direction;
• and
• wherein vertical wires disposed on one of the lower pads for at least every other pair of pads which are electrically connected by the bent wires in the first direction,
• wherein the metal pillars are disposed on the lower pad for at least every other pair of pads which are electrically connected by the bent wire,
• wherein the metal pillars and the vertical wires are alternately disposed on pairs of pads in the second direction.