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AssigneesSTMicroelectronics (Crolles 2) SAS, STMicroelectronics (Grenoble 2) SAS
InventorsEric Sabouret, Krysten Rochereau, Olivier Hinsinger, Flore Persin-Crelerot
Estimating the term…
An integrated circuit includes a solder pad which includes, in a superposition of metallization levels, an underlying structure formed by a network of first regular metal tracks that are arranged for reinforcing the mechanical strength of the underlying structure and electrically connecting between an upper metallization level and a lower metallization level of the underlying structure. The underlying structure further includes a detection electrical path formed by second metal tracks passing between the first metal tracks in the metallization levels, the detection electrical path having an input terminal and an output terminal. Electrical sensing of the detection electrical path is made to supply a measurement which is indicative of the presence of cracks in the underlying structure.
A method, comprising:
A method for testing an integrated circuit which comprises a structure underlying a solder pad, said structure including a network of first parallel metal tracks under and electrically connected to the solder pad and a detection electrical path formed by second metal tracks under the solder pad and insulated from and passing between the first parallel metal tracks, the method comprising:
Dependencies are inferred from the claim text.