Integrated circuit devices having improved contact plug structures therein
AssigneeSamsung Electronics Co., Ltd.
InventorsWon Kyu Han, Myeongsoo Lee, Rakhwan Kim, Woojin Jang
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AssigneeSamsung Electronics Co., Ltd.
InventorsWon Kyu Han, Myeongsoo Lee, Rakhwan Kim, Woojin Jang
Estimating the term…
An integrated circuit device includes a substrate and a first electrically insulating layer on the substrate. An electrically conductive contact plug is provided, which extends at least partially through the first electrically insulating layer. The contact plug includes a protrusion having a top surface that is spaced farther from the substrate relative to a top surface of a portion of the first electrically insulating layer extending adjacent the contact plug. An electrically conductive line is provided with a terminal end, which extends on a first portion of the protrusion. A second electrically insulating layer is provided, which extends on a second portion of the protrusion and on the first electrically insulating layer. The second electrically insulating layer has a sidewall, which extends opposite a sidewall of the terminal end of the electrically conductive line.
An integrated circuit device comprising:
An integrated circuit device comprising:
An integrated circuit device, comprising:
Dependencies are inferred from the claim text.