Package structure and method of manufacturing the same

A package structure, comprising:

• an insulator, wherein the insulator comprises a dielectric material;
• a die, disposed on the insulator;
• an adhesive layer, disposed between the die and the insulator;
• and
• an encapsulant, disposed on the insulator and laterally encapsulating sidewalls of the die and the insulator,
• wherein the insulator comprises a coefficient of thermal expansion lager than a coefficient of thermal expansion of the die and less than a coefficient of thermal expansion of the encapsulant.

A method of fin wing a package structure, comprising:

• forming a through via on a first conductive feature structure;
• forming an insulator on the first conductive feature structure;
• mounting a die on the insulator over the first conductive feature structure through an adhesive layer, wherein the adhesive layer is disposed between the die and the insulator;
• and
• forming an encapsulant on the insulator and the first conductive feature structure to laterally encapsulate sidewalls of the die, wherein the insulator has a bottom surface in physical contact with a polymer layer of the first conductive feature structure,
• wherein the through via extends through the encapsulant to connect to the first conductive feature structure,
• wherein the insulator comprises a coefficient of thermal expansion lager than a coefficient of thermal expansion of the die and less than a coefficient of thermal expansion of the encapsulant.