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US 11,908,786 B2Granted
Wiring structure
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorTing Wei Hsu
Life of this patent
Estimating the term…
Abstract
A wiring structure includes a test pattern layer. The test pattern layer includes a test circuit pattern and a heat dissipating structure. The heat dissipating structure is disposed adjacent to the test circuit pattern, and is configured to reduce temperature rise of the test circuit pattern when a power is applied to the test circuit pattern.
Claims19
A wiring structure, comprising:
- a test pattern layer, comprising:
- a plurality of test circuit patterns intersected with each other at an intersection portion;
- and
- a heat dissipating structure disposed adjacent to the plurality of test circuit patterns, and configured to reduce temperature rise of the plurality of test circuit patterns when a power is applied to the plurality of test circuit patterns, wherein the heat dissipating structure is spaced apart from the intersection portion.
1 more element
A wiring structure, comprising:
- a dielectric layer;
- a circuit pattern layer disposed on the dielectric layer;
- and
- a test pattern layer disposed on the dielectric layer, and spaced apart from the circuit pattern layer, and comprising:
- a test circuit pattern;
- and
- an etching buffer layer disposed adjacent to the test circuit pattern, and configured to reduce a delamination between the test circuit pattern and the dielectric layer.
4 more elements
A wiring structure, comprising:
- a dielectric layer having a first region and a second region;
- a circuit pattern layer disposed in the first region;
- and
- a test pattern layer disposed in the second region, and comprising:
- at least two test circuit patterns intersected with each other at an intersection portion;
- and
- a heat dissipating layer disposed around the intersection portion.
4 more elements
Dependencies are inferred from the claim text.