Wiring substrate, semiconductor package having the wiring substrate, and manufacturing method thereof

A semiconductor package, comprising:

• a first power device having a first surface, a second surface opposite to the first surface, a first terminal adjacent to the first surface of the first power device, and a first control terminal;
• a first lower wiring adjacent to the second surface of the first power device;
• a first insulating layer covering the first power device, and the first lower wiring, wherein:
• the first insulating layer comprises first openings extending from a first surface of the first insulating layer to the first terminal;
• a first conductive layer over the first terminal and but not over the first control terminal;
• a second conductive layer over the first terminal and the first control terminal;
• and
• a second insulating layer;
• wherein:
• the second conductive layer is within the first openings;
• the second conductive layer is interposed between the first terminal and the first conductive layer;
• the second conductive layer and the first conductive layer are within the second insulating layer;
• the first conductive layer comprises a first conductive layer top side distal to the second conductive layer;
• and
• the second insulating layer overlaps and covers the first conductive layer top side.

A method of making a semiconductor package, comprising:

• providing a semiconductor device comprising a first terminal and a second terminal;
• providing a first conductive layer over the second terminal;
• providing a first insulating layer over the first terminal and the second terminal;
• providing a second insulating layer over the first terminal;
• providing a first via that extends through the first insulating layer and the second insulating layer to expose at least a portion of the first terminal;
• providing a second via that extends through the first conductive layer and the first insulating layer to expose at least a portion of the second terminal;
• and
• providing a second conductive layer having a first portion within the first via and having a second portion over the first conductive layer and within the second via, wherein:
• the first insulating layer is interposed between the first conductive layer and the second terminal and interposed between the second insulating layer and the first terminal;
• the first portion of the second conductive layer is part of a first wiring route;
• the second portion of the second conductive layer and the first conductive layer are part of a second wiring route;
• and
• the first wiring route is devoid of the first conductive layer.