Spacers formed on a substrate with etched micro-springs

A method comprising:

• depositing a release layer on a substrate, wherein the substrate comprises superconducting circuits or low temperature electronics that are subject to damage at maximum processing temperatures at or above 150° C., wherein the method is performed at a processing temperature below 150° C.;
• depositing an elastic metal on the release layer, the elastic metal having an intrinsic stress profile;
• etching through the layer of the elastic metal to form one or more elastic members;
• coating a spacer material onto the substrate;
• patterning the spacer material to form one or more spacers at least partially surrounding the elastic members, wherein the one or more spacers comprise:
• a main structure elongated along a first direction;
• and
• tabs extending from the main structure at an angle to the first direction, the tabs preventing delamination of the main structure;
• and
• undercut etching the release layer to release a free end of the elastic member from the substrate while leaving an anchor portion of each of the elastic members fixed to the substrate, the intrinsic stress profile in the elastic member biasing the free end of the elastic member away from the substrate to form an out of plane structure upon release of the free end.