Semiconductor device package and a method of manufacturing the same

A semiconductor package structure, comprising:

• a circuit structure;
• an encapsulant connected to the circuit structure and including an upper surface and a first lateral side surface;
• a plurality of first patterned conductive layers disposed on the upper surface and the first lateral side surface of the encapsulant and separated from each other;
• and
• a first electronic component disposed over the encapsulant and electrically connected to the circuit structure through the plurality of first patterned conductive layers,
• wherein a portion of the first lateral side surface of the encapsulant is exposed by the plurality of first patterned conductive layers.

A semiconductor package structure, comprising:

• a circuit structure;
• an encapsulant connected to the circuit structure and including an upper surface and a first lateral side surface;
• a plurality of first patterned conductive layers disposed on the upper surface and the first lateral side surface of the encapsulant and separated from each other;
• and
• a first electronic component disposed over the encapsulant and electrically connected to the circuit structure through the plurality of first patterned conductive layers,
• wherein the plurality of first patterned conductive layers include at least two different widths from a top view.

A semiconductor package structure, comprising:

• a substrate including a first surface;
• a first encapsulant covering the first surface of the substrate and including an upper surface and a lateral side surface;
• a patterned conductive layer extending on the upper surface and the lateral side surface of the first encapsulant;
• and
• a first electronic component disposed on the patterned conductive layer;
• and
• a second electronic component encapsulated by the first encapsulant and electrically connected to the first electronic component through the substrate and the patterned conductive layer,
• wherein the patterned conductive layer includes a second portion disposed on the upper surface of the first encapsulant, and
• wherein the second portion includes a first lateral side surface and a first recess recessed from the first lateral side surface from a cross-sectional view.