Semiconductor module

A semiconductor module comprising:

• a semiconductor element having one surface and a back surface opposite to the one surface, and including a first main electrode placed on the one surface and a second main electrode placed on the back surface;
• a conductive member placed to sandwich the semiconductor element, and including a first conductive member placed close to the one surface and connected to the first main electrode, and a second conductive member placed close to the back surface and connected to the second main electrode;
• a main terminal extending from the conductive member and including a first main terminal continuous from the first conductive member and a second main terminal continuous from the second conductive member;
• and
• a sealing resin body integrally sealing at least a part of each of the first conductive member and the second conductive member, a part of each of the first main terminal and the second main terminal, and the semiconductor element, wherein
• the main terminal has:
• a facing portion that is placed to cancel a magnetic flux generated when a main current flows, and is a portion where a plate surface of the first main terminal and a plate surface of the second main terminal face each other with a predetermined gap therebetween;
• a non-facing portion that is continuous from the facing portion of the first main terminal on a side opposite to the first conductive member;
• and
• a connection portion that includes a first connection portion formed on the plate surface of the first main terminal in the non-facing portion of the first main terminal, and a second connection portion formed on another plate surface of the second main terminal opposite to the plate surface facing the first main terminal and formed in at least the facing portion of the second main terminal,
• in a width direction orthogonal to an arrangement direction in which the facing portion and the non-facing portion of the first main terminal are arranged, a formation position of the second connection portion overlaps with a formation position of the first connection portion,
• the sealing resin body is interposed between the first main terminal and the second main terminal that form the facing portion,
• the second main terminal is placed to straddle the first main terminal in the width direction,
• the non-facing portion placed in the first main terminal is a first non-facing portion,
• the main terminal further includes a plurality of second non-facing portions that are continuous from both ends of the facing portion of the second main terminal in the width direction, and
• the first connection portion and the second connection portion are exposed from the sealing resin body as a connection region connected with an outside.