Semiconductor package with plurality of leads and sealing resin

A semiconductor device comprising:

• leads each including a lead body portion having an upper surface as a chip mount portion and a lower surface, a lead connecting portion having a lower surface for external connection, the lower surface projects downward from the lower surface of the lead body portion, and an inner corner portion defined between the lead connecting portion and the lower surface of the lead body portion and having a curved shape;
• a first sealing resin that is formed below the lead body portions and in contact with both of the inner corner portion and the lead connecting portion;
• a semiconductor chip that includes electrode pads electrically connected to corresponding upper surfaces of the lead body portions and that has a facing surface facing to the upper surfaces of the lead body portions and the upper surface of the first sealing resin;
• and
• a second sealing resin that enters into a region between the upper surface of the first sealing resin and the semiconductor chip, and that seals the upper surfaces of the leads, the upper surface of the first sealing resin and the semiconductor chip on the lead body portions, and that forms a boundary surface with the upper surfaces of the lead body portions and the upper surface of the first sealing resin, and
• wherein the lower surface of each lead connecting portion of the leads is exposed from the lower surface of the first sealing resin.