Cooling system where semiconductor component comprising semiconductor chip and cooling apparatus are joined

A cooling system where a semiconductor component comprising a semiconductor chip and a cooling apparatus are joined, the system comprising:

• a semiconductor component comprising at least one substrate, where at least one semiconductor chip is installed on one side thereof, a package housing covering the at least one substrate, and at least one terminal lead electrically connected to the at least one semiconductor chips and exposed to the outside of the package housing, wherein the other side of the at least one substrate is partly or entirely exposed to an upper surface, a lower surface, or the upper and lower surfaces of the package housing;
• and
• a cooling apparatus comprising a cover body and at least one cooling post, wherein the cover body comprises a coolant flow path in an inner space thereof and at least one opening member on one side thereof where the at least one substrate contacts, and the at least one cooling post is arranged vertically across the inner space of the cover body and is formed of a conductive or non-conductive material,
• wherein the cooling apparatus further comprises at least one inlet, where a coolant flows in, and at least one outlet, from where a coolant is discharged, a length of the at least one substrate exposed to the surface of the package housing is longer than a length of the at least one opening member, and heat generated and transmitted from the semiconductor chip to the at least one substrate, which is exposed through the at least one opening member, and the at least one cooling post is directly cooled by a coolant,
• wherein the at least one cooling post comprises a plurality of cooling posts, and a distance between proximal ends of adjacent cooling posts and a distance between distal ends of the adjacent cooling posts are different from each other.