Temporary protective film for semiconductor sealing molding, lead frame with temporary protective film, sealed molded body with temporary protective film, and method for producing semiconductor device
AssigneeResonac Corporation
InventorsNaoki Tomori, Tomohiro Nagoya, Takahiro Kuroda
Life of this patent
Estimating the term…
Abstract
A temporary protective film comprising a support film and an adhesive layer provided on one surface or both surfaces of the support film is disclosed. The coefficient of linear expansion at 30° C. to 200° C. of the temporary protective film may be greater than or equal to 16 ppm/° C. and less than or equal to 20 ppm/° C. in at least one in-plane direction of the temporary protective film.
Claims16
A temporary protective film for semiconductor sealing molding, comprising a support film and an adhesive layer provided on one surface or both surfaces of the support film,
- wherein the adhesive layer contains an aromatic polyether amideimide,
- wherein the support film comprises a film of an aromatic polyimide,
- wherein an elastic modulus at 30° C. of the temporary protective film is 9 GPa or less, and
- wherein a coefficient of linear expansion at 30° C. to 200° C. of the temporary protective film is greater than or equal to 16 ppm/° C. and less than or equal to 20 ppm/° C. in at least one in-plane direction of the temporary protective film.
A temporary protective film for semiconductor sealing molding, comprising a support film and an adhesive layer provided on one surface or both surfaces of the support film,
- wherein the adhesive layer contains an aromatic polyether amideimide,
- wherein the support film comprises a film of a an aromatic polyimide,
- wherein a ratio of a thickness of the adhesive layer to a thickness of the support film is 0.2 or less
- wherein an elastic modulus at 30° C. of the temporary protective film is 9 GPa or less, and
- wherein a coefficient of linear expansion at 30° C. to 200° C. of the temporary protective film is greater than or equal to 16 ppm/° C. and less than or equal to 20 ppm/° C. in at least one in-plane direction of the temporary protective film.
Dependencies are inferred from the claim text.