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US 11,908,760 B2Granted
Package with encapsulated electronic component between laminate and thermally conductive carrier
AssigneeInfineon Technologies AG
InventorAndreas Grassmann
Life of this patent
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Abstract
A package is disclosed. In one example, the package comprises a carrier comprising a thermally conductive and electrically insulating layer, a laminate comprising a plurality of connected laminate layers, an electronic component mounted between the carrier and the laminate. An encapsulant is at least partially arranged between the carrier and the laminate and encapsulating at least part of the electronic component.
Claims20
A package, wherein the package comprises:
- a carrier comprising a thermally conductive and electrically insulating layer, a planar first electrically conductive layer on a first main face of the thermally conductive and electrically insulating layer, and a planar second electrically conductive layer on a second main face of the thermally conductive and electrically insulating layer opposing the first main face;
- a laminate comprising a plurality of connected laminate layers;
- an electronic component mounted between the carrier and the laminate;
- and
- an encapsulant being at least partially arranged between the carrier and the laminate and encapsulating at least part of the electronic component.
2 more elements
A method of manufacturing a package, wherein the method comprises:
- providing a carrier comprising a thermally conductive and electrically insulating layer, a planar first electrically conductive layer on a first main face of the thermally conductive and electrically insulating layer, and a planar second electrically conductive layer on a second main face of the thermally conductive and electrically insulating layer opposing the first main face;
- providing a laminate comprising a plurality of connected laminate layers;
- mounting an electronic component between the carrier and the laminate;
- and
- encapsulating at least part of the electronic component by an encapsulant which is at least partially arranged between the carrier and the laminate.
2 more elements
Dependencies are inferred from the claim text.