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US 11,908,756 B2Granted
Interposer chips and enclosures for quantum circuits
AssigneeInternational Business Machines Corporation
InventorsDavid Abraham, John Michael Cotte
Life of this patent
Estimating the term…
Abstract
Techniques regarding qubit chip assemblies are provided. For example, one or more embodiments described herein can include an apparatus that can comprise a qubit chip positioned on an interposer chip. The apparatus can also comprise an electrical connector in direct contact with the interposer chip. The electrical connector can establish an electrical communication between a wire and a contact pad of the interposer chip that is coupled to the qubit chip.
Claims20
An apparatus comprising:
- a qubit chip positioned on an interposer chip;
- an electrical connector in direct contact with the interposer chip, wherein the electrical connector establishes an electrical communication between a wire and a contact pad of the interposer chip that is coupled to the qubit chip;
- an enclosure lid positioned adjacent to the qubit chip and the interposer chip, wherein the electrical connector extends through the enclosure lid;
- and
- an isolation barrier extending from the enclosure lid to the interposer chip, wherein the isolation barrier at least partially surrounds the qubit chip.
2 more elements
An apparatus comprising:
- a qubit chip enclosure lid;
- an electrical connector that extends through the qubit chip enclosure lid, wherein the electrical connector has a pressure connection portion and a wire connection portion positioned at opposite ends of the electrical connector;
- and
- a qubit chip enclosure that comprises a base and a plurality of side walls, wherein the plurality of side walls extend from the base and support the qubit chip enclosure lid.
1 more element
A method comprising:
- positioning a qubit chip assembly within a qubit chip enclosure such that the qubit chip assembly is positioned between side walls of the qubit chip enclosure;
- and
- directly coupling an interposer chip of the qubit chip assembly to an electrical connector, wherein the electrical connector extends through a qubit chip enclosure lid, and wherein the interposer chip is further coupled to a qubit chip.
Dependencies are inferred from the claim text.