Test head connection method
AssigneeChroma Ate Inc.
InventorsKao-Shan Yang, Ching-Li Lin
Life of this patent
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Abstract
Herein disclosed is a test head connection method, the method comprises the following steps. First, a load board and a card holder are provided between a test head and a probing machine, the card holder is disposed in the probing machine, and the card holder is used to accommodate the load board. A vacuum function of the test head is activated, and the test head is moved to align the card holder. The test head is moved to touch the load board in the card holder. At least one clamping piece is used to fix the test head and the card holder. Wherein the load board and a wafer are connected by direct probing.
Claims10
A test head connection method for connecting a test head and a probing machine, comprising:
- disposing a load board and a test fixture between the test head and the probing machine;
- activating a vacuum function of the test head;
- moving the test head to align the test fixture;
- moving the test head until touching the load board in the test fixture;
- and
- fixing the test head and the test fixture by at least one engaging member;
- wherein the test fixture is disposed in the probing machine, and the test fixture is used to accommodate the load board;
- wherein the load board is configured to connect a wafer by direct docking without a pogo tower.
Dependencies are inferred from the claim text.