Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures

A method for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process, the method comprising:

• providing a substrate comprising a dielectric surface into a reaction chamber;
• depositing a nucleation film comprising a silicon compound material directly on the dielectric surface, wherein depositing the nucleation film comprises repeating unit cycles of the cyclical deposition process to form the nucleation film having a thickness of less than 10 Angstroms, wherein at least one of the unit cycles comprises:
• contacting the substrate with a first vapor phase reactant comprising a silicon precursor;
• and
• contacting the substrate with a second vapor phase reactant comprising at least one of a nitrogen precursor, an oxygen precursor, or a carbon precursor, wherein the nitrogen precursor comprises at least one of ammonia, hydrazine, triazane, tertbutylhydrazine, methylhydrazine, dimethylhydrazine, or a nitrogen plasma, wherein the oxygen precursor comprises at least one of water, hydrogen peroxide, ozone, or an oxide of nitrogen comprising at least one of nitrogen monoxide, nitrous oxide, or nitrogen dioxide, and wherein the carbon precursor comprises a hydrocarbon;
• and
• depositing a molybdenum metal film directly on the nucleation film, wherein depositing the molybdenum metal film comprises:
• contacting the substrate with a first vapor phase reactant comprising a molybdenum halide precursor;
• and
• contacting the substrate with a second vapor phase reactant comprising a reducing agent precursor.