Support substrates, methods of fabricating semiconductor packages using the same, and methods of fabricating electronic devices using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsKunsil Lee, Seung Hwan Lee
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Abstract
Disclosed are support substrates, methods of fabricating semiconductor packages using the same, and methods of fabricating electronic devices using the same. The support substrate comprises a main body, and a plurality of first protrusions finely protruding from an upper surface of the main body. The main body and the first protrusions include the same material and are formed as a unitary structure. The first protrusions are spaced apart from each other in first and second directions intersecting each other, when viewed in plan.
Claims20
A support substrate, comprising:
- a main body;
- a support layer is formed on a lower surface of the main body;
- and
- a plurality of protrusions protruding from an upper surface of the main body,
- wherein the main body, the support layer and the plurality of protrusions comprise the same material, and
- the main body and the plurality of protrusions are formed as a unitary structure, and
- wherein, in a plan view, the plurality of protrusions are spaced apart from each other in first and second directions to bond the plurality of protrusions with an object provided on the plurality of protrusions with a nail shape.
A support substrate, comprising:
- a main body;
- a support layer is formed on a lower surface of the main body;
- and
- a plurality of protrusions protruding from an upper surface of the main body,
- wherein the main body, the support layer and the plurality of protrusions comprise the same material, and
- the main body and the plurality of protrusions are formed as a unitary structure, and
- wherein, in a plan view, the plurality of protrusions are spaced apart from each other in first and second directions to bond the plurality of protrusions with an object provided on the plurality of protrusions.
A support substrate, comprising:
- a main body;
- a support layer is formed on a lower surface of the main body;
- and
- a plurality of protrusions protruding from an upper surface of the main body,
- wherein the main body and the plurality of protrusions comprise the same material, and
- the main body and the plurality of protrusions are formed as a unitary structure, and
- wherein, in a plan view, the plurality of protrusions are spaced apart from each other in first and second directions to bond the plurality of protrusions with an object provided on the plurality of protrusions with a nail shape.
Dependencies are inferred from the claim text.