Laser de-bonding carriers and composite carriers thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHuicheng Chang, Jyh-Cherng Sheu, Chen-Fong Tsai, Yun Chen Teng, Han-De Chen, Yee-Chia Yeo
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Abstract
A method includes bonding a package component to a composite carrier. The composite carrier includes a base carrier and an absorption layer, and the absorption layer is between the base carrier and the package component. A laser beam is projected onto the composite carrier. The laser beam penetrates through the base carrier to ablate the absorption layer. The base carrier may then be separated from the package component.
Claims20
A method comprising:
- bonding a package component to a composite carrier, wherein the composite carrier comprises:
- a base carrier;
- and
- an absorption layer, wherein the absorption layer is between the base carrier and the package component, and wherein the absorption layer comprises a titanium nitride layer;
- projecting a laser beam onto the composite carrier, wherein the laser beam penetrates through the base carrier to ablate the absorption layer;
- and
- separating the base carrier from the package component.
A structure comprising:
- a composite carrier comprising:
- a silicon substrate;
- a transparent layer;
- an absorption layer over the transparent layer, wherein the absorption layer comprises titanium;
- and
- a bond layer over the absorption layer, wherein an entirety of each of the transparent layer, the absorption layer, and the bond layer is a planar layer.
A structure configured to be de-bonded by a laser beam, the structure comprising:
- a base carrier, wherein an entirety of the base carrier is formed of a homogeneous material, and wherein the base carrier is transparent to the laser beam;
- a metal-containing absorption layer over the base carrier, wherein the metal-containing absorption layer is configured to absorb the laser beam;
- a metal-containing reflection layer over the metal-containing absorption layer, wherein the metal-containing reflection layer is configured to reflect the laser beam;
- and
- a bond layer over the metal-containing reflection layer.
Dependencies are inferred from the claim text.