Semiconductor packages with die including cavities

A semiconductor package comprising:

• a semiconductor die comprising a first side and a second side opposite the first side;
• a cavity extending into the second side of the semiconductor die and only partially through the semiconductor die;
• a backmetal coupled within the cavity;
• and
• an organic material coupled over the first side of the semiconductor die and over an entirety of each sidewall of a plurality of sidewalls of the semiconductor die;
• wherein an outer perimeter of the backmetal is a same size and shape as an outermost perimeter of the semiconductor die;
• and
• wherein an entirety of the first side lies in a same plane and extends to the outermost perimeter of the semiconductor die.