Method for manufacturing nitride semiconductor substrate, nitride semiconductor substrate and layered structure
AssigneeSumitomo Chemical Company, Limited
InventorTakehiro Yoshida
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AssigneeSumitomo Chemical Company, Limited
InventorTakehiro Yoshida
Estimating the term…
A method for manufacturing a nitride semiconductor substrate, including: a step of preparing a base substrate; a step of forming a mask layer having a plurality of openings on the main surface of the base substrate; a first step of growing a first layer whose surface is composed only of inclined interfaces; and a second step of epitaxially growing a single crystal of a group III nitride semiconductor on the first layer, making the inclined interfaces disappear, and growing a second layer having a mirror surface, wherein in the first step, at least one valley and a plurality of tops are formed at an upper side of each of the plurality of openings of the mask layer by forming a plurality of concaves on a top surface of the single crystal and making the (0001) plane disappear.
A method for manufacturing a nitride semiconductor substrate, which is a method for manufacturing a nitride semiconductor substrate with a vapor deposition method, comprising:
A nitride semiconductor substrate, having a diameter of 2 inches or more and having a main surface whose closest low index crystal plane is a (0001) plane,
A laminated structure, comprising:
Dependencies are inferred from the claim text.