Semiconductor fabricating system having hybrid brush assembly

A semiconductor fabricating system, comprising:

• a chamber;
• a wafer holder in the chamber and having a bottom surface for holding a wafer;
• a brush assembly in the chamber and movable below the bottom surface of the wafer holder, wherein the brush assembly comprises:
• a base plate;
• an inner brush member disposed on the base plate and comprising:
• a first base portion;
• and
• protruding portions protruding from the first base portion of the inner brush member;
• and
• an outer brush member disposed on the base plate and comprising:
• a second base portion directly between the base plate and the first base portion of the inner brush member, wherein the first base portion and the second base portion have different materials;
• and
• a peripheral portion over the second base portion of the outer brush member and surrounding the protruding portions of the inner brush member, wherein the protruding portions of the inner brush member define inner grooves therebetween, and the peripheral portion of the outer brush member has outer grooves therein, and widths of the outer grooves are greater than widths of the inner grooves;
• a shaft, connected to the base plate of the brush assembly;
• an actuator, connected to the shaft;
• and
• a controller programmed to send electric signal to the actuator to drive the base plate to move below the bottom surface of the wafer holder.

A semiconductor fabricating system, comprising:

• a chamber;
• a wafer holder suspending from a top surface of the chamber;
• a first brush assembly in the chamber and comprising:
• a first base plate;
• an inner brush member over the first base plate;
• and
• an outer brush member over the first base plate and surrounding the inner brush member, wherein the outer brush member has a vertical thickness greater than a vertical thickness of the inner brush member, wherein the outer brush member has a material softer than a material of the inner brush member, wherein the outer brush member has a tapered top portion in a cross-sectional view, wherein an upper surface of the inner brush member is in a level position that is higher than a lowermost position of the tapered top portion and lower than an uppermost position of the tapered top portion, wherein the inner brush member comprises inner grooves, wherein the outer brush member comprises outer grooves, and wherein the inner and outer grooves are substantially aligned;
• a first manipulate module connected to the first brush assembly and configured to manipulate a movement of the first brush assembly in the chamber;
• a second brush assembly in the chamber, wherein the second brush assembly has a configuration different from the first brush assembly;
• and
• a second manipulate module connected to the second brush assembly and configured to manipulate a movement of the second brush assembly in the chamber.