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US 11,908,669 B2Granted
Thermally controlled magnetic fields optimization system for sputter deposition processes
AssigneeArizona Thin Film Research, LLC
InventorPatrick Morse
Life of this patent
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Abstract
The present disclosure provides systems and methods of controlling a magnetically confined plasma sputtering process using the waste heat transferred from the plasma into the target material and then into thermally controlled magnetic field adjustment assemblies that modify the strength of the plasma confinement magnetic fields on the target material.
Claims7
A magnetic field control device for a plasma sputtering process, comprising:
- at least one thermally controlled magnetic field assembly with at least one magnet that modifies a magnetic field strength of a plasma confining magnetic field on a sputtering surface of a target material based on a local temperature of cooling water directed proximate a specific magnet, the cooling water used to remove local thermal energy transferred to the target material from the plasma sputtering process;
- and
- a housing structure containing the at least one thermally controlled magnetic field assembly that directs the cooling water to the specific magnet to deliver heated cooling water to thermally controlled magnetic field assembly for changing a local plasma intensity on the sputtering surface of the target material.
Dependencies are inferred from the claim text.