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US 11,908,612 B2Granted
Coil component
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsDong Seob Lee, Jong Min Lee
Life of this patent
Estimating the term…
Abstract
A coil component includes an insulating substrate; a coil portion disposed on at least one surface of the insulating substrate; and a body embedding the insulating substrate and the coil portion and having an active portion in which the coil portion is disposed, and a cover portion disposed on the active portion. A ratio of a thickness (T2) of the cover portion to a thickness (T1) of the insulating substrate satisfies 3<T2/T1<6, and the thickness (T2) of the cover portion satisfies 90 μm<T2<120 μm.
Claims10
A coil component comprising:
- an insulating substrate;
- a first coil pattern, having a planar spiral shape, disposed on one surface of the insulating substrate;
- a second coil pattern, having a planar spiral shape, disposed on the other surface of the insulating substrate opposing the one surface of the insulating substrate;
- and
- a body embedding the insulating substrate and the first and second coil patterns, and having an active portion in which the first and second coil patterns are disposed, an upper cover portion disposed on an upper surface of the active portion and a lower cover portion disposed on a lower surface of the active portion,
- wherein a thickness of the body is 550 μm or less (excluding 0), and
- a total thickness of the upper and lower cover portions is thicker than four times of a thickness of the insulating substrate and thinner than a total thickness of the first and second coil patterns.
4 more elements
Dependencies are inferred from the claim text.