Memory device and operating method for computing-in-memory
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHidehiro Fujiwara, Haruki Mori, Wei-Chang Zhao
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHidehiro Fujiwara, Haruki Mori, Wei-Chang Zhao
Estimating the term…
A memory device and an operating method for computing-in-memory (CIM) are provided. The memory device for CIM comprises a plurality of memory banks and a global multiply accumulate (MAC) circuit. Each of the memory banks comprises a first memory array, a first latch circuit, a second latch circuit and a local MAC circuit. The first latch circuit latches a first data from the first memory array in a first read cycle. The second latch circuit latches a second data from the first memory array in a second read cycle. The local MAC circuit performs a first stage CIM operation on a first latched data latched in the first latch circuit and the second latched data latched in the second latch circuit to provide a first stage CIM result. The global MAC circuit performs a second stage CIM operation on a plurality of first stage CIM results from the memory banks.
A memory device for computing in memory (CIM), comprising:
A memory device for computing in memory (CIM), comprising:
An operating method for computing-in-memory (CIM) of a memory device, wherein the memory device comprises a plurality of memory banks and a global multiply accumulate (MAC) circuit, wherein each of the plurality of memory banks comprises first memory array, a first latch circuit, a second latch circuit and a local MAC circuit, wherein the operating method comprises:
Dependencies are inferred from the claim text.