Cell structures and power routing for integrated circuits

An integrated circuit, comprising:

• a first cell comprising a first metal layer comprising a first power stripe that is operable to connect to a first voltage source to supply a first voltage signal and a first metal stripe divided into multiple metal segments,
• wherein a first metal segment in the multiple metal segments extends outside a boundary of the first cell and is operable to supply a second voltage signal to the first cell;
• a second cell adjacent the first cell, the second cell comprising the first metal layer comprising the first power stripe that is operable to supply the first voltage signal and a second metal stripe divided into multiple metal segments,
• wherein a second metal segment in the multiple metal segments extends outside a boundary of the second cell and is operable to supply the second voltage signal to the second cell, and
• wherein the second metal segment includes one or more conductor pillars each connected to the first power stripe,
• wherein the first metal segment and the second metal segment form one metal segment that resides between and in the first and the second cells.

A method of fabricating an integrated circuit, the method comprising:

• forming a first conductor layer over the integrated circuit, wherein the first conductor layer includes a conductor stripe that is divided into multiple conductor segments and a first power stripe that is configured to provide a first voltage signal;
• forming a contact layer overlying the first conductor layer;
• forming a second conductor layer overlying the contact layer and comprising a second power stripe and one or more conductor pillars, wherein the second power stripe is configured to provide a second voltage signal, wherein a contact in the contact layer electrically connects a first conductor segment in the multiple conductor segments to the second power stripe to provide the second voltage signal to the first conductor layer, and wherein each conductor pillar is electrically connected to the first power stripe,
• forming a third conductor layer disposed between the first and second conductor layers, the third conductor layer providing one or more contacts between the first and the second conductor layers.