Component identification
AssigneeHutchinson Technology Incorporated
InventorsDean E. Myers, Michael W. Davis, Clark T. Olsen, Beauregard J. Gagnon
Life of this patent
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Abstract
An identification device includes a first metal layer patterned into a planar coil winding and a second metal layer electrically connected to the first metal layer. The first metal layer is operable to provide a circuit inductance. The second metal layer is patterned to provide one or more overlapping areas with the first metal layer. The second metal layer is operable to provide a circuit capacitance. The identification device includes a dielectric layer separating the first metal layer and the second metal layer.
Claims21
An identification device comprising:
- a first metal layer patterned into a planar coil winding configured to have an inductance;
- a second metal layer electrically connected to the first metal layer, the second metal layer includes an outer layer and a central overlapping area connected to the outer layer that overlaps with the first metal layer and configured to have a capacitance, wherein an aperture is formed between the central overlapping area and the outer layer;
- and
- a dielectric layer separating the first metal layer and the second metal layer.
A component comprising:
- an identification device including:
- a first metal layer patterned into a planar coil winding configured to have an inductance;
- a second metal layer electrically connected to the first metal layer, the second metal layer is patterned to provide an outer layer and a central overlapping area that connects to the outer layer and overlaps with the first metal layer and is configured to have a capacitance, wherein an aperture is formed between the central overlapping area and the outer layer;
- and
- a dielectric layer separating the first metal layer and the second metal layer.
Dependencies are inferred from the claim text.