Layout for integrated circuit and the integrated circuit

A layout method, comprising:

• selecting a first layout device in a layout of an integrated circuit;
• selecting a second layout device abutting the first layout device at a boundary between the first layout device and the second layout device,
• disposing a first conductive path and a second conductive path across a boundary between a first layout device and a second layout device abutting the first layout device, and
• disposing a first cut layer on the first conductive path on the boundary;
• disposing a second cut layer on the second conductive path nearby the boundary;
• moving the first cut layer to align and be in contact with the second cut layer;
• and
• disposing a third cut layer and a fourth cut layer on first edges of the first conductive path and the second conductive path respectively.

A layout method, comprising:

• disposing a first conductive path and a second conductive path across a boundary between a first layout device and a second layout device abutting the first layout device,
• disposing a first cut layer on the first conductive path in one of the first layout device and the second layout device;
• disposing a second cut layer on the second conductive path in the one of the first layout device and the second layout device;
• moving the first cut layer to align with the second cut layer;
• and
• disposing a third cut layer and a fourth cut layer on first edges of the first conductive path and the second conductive path respectively.