Serial interface for semiconductor package
AssigneeKioxia Corporation
InventorsBenjamin Kerr, Philip Rose, Robert Reed
Life of this patent
Estimating the term…
Abstract
A system for serial communication includes a controller, a semiconductor package comprising a plurality of semiconductor die, and a serial interface configured to connect the plurality of semiconductor die to the controller. The serial interface includes a controller-to-package connection and a package-to-controller connection, and the serial interface is configured to employ a signaling protocol using differential data signaling with no separate clock signals.
Claims23
A system for serial communication, comprising:
- a controller;
- a semiconductor package comprising a semiconductor memory;
- and
- a serial interface configured to connect the semiconductor memory to the controller,
- wherein the serial interface is configured to transfer data between the controller and the semiconductor memory at a speed of transfer that is variable by employing a signaling protocol, and
- wherein the serial interface is configured to transfer the data together with an encoded clock signal, the encoded clock signal having a rate associated with the variable speed of transfer of data, wherein the encoded clock signal is embedded together with the data in a transmitted signal.
A semiconductor package, comprising:
- a flash memory;
- and
- a bridge device comprising a high-speed serial interface connected to an external controller and a parallel interface connected to the flash memory,
- wherein the high-speed serial interface is configured to transfer data between the external controller and the flash memory at a speed of transfer that is variable by employing a signaling protocol, and
- wherein the high-speed serial interface is configured to transfer the data together with an encoded clock signal, the encoded clock signal having a rate associated with the variable speed of transfer of data, wherein the encoded clock signal is embedded together with the data in a transmitted signal.
A method for communication for a semiconductor package comprising a package controller, a serial interface, and a parallel interface, the method comprising:
- receiving, by the serial interface from an external controller, a first communication comprising device identity information, the first communication configured to transfer data between the external controller and the semiconductor package at a speed of transfer that is variable according to a signaling protocol, wherein the serial interface is configured to transfer the data together with an encoded clock signal, the encoded clock signal having a rate associated with the variable speed of transfer of data, wherein the encoded clock signal is embedded together with the data in a transmitted signal;
- identifying, by the package controller, a first semiconductor die based on the device identity information;
- routing, by the package controller, a second communication to the first semiconductor die via the parallel interface;
- receiving, by the package controller from the first semiconductor die, via the parallel interface, a third communication;
- and
- transmitting, by the package controller to the external controller via the serial interface using the signaling protocol that includes the encoded clock signal, a fourth communication based on the third communication.
Dependencies are inferred from the claim text.