Electronic paper package structure
AssigneeE Ink Holdings Inc.
InventorJen-Shiun Huang
Life of this patent
Estimating the term…
Abstract
An electronic paper package structure including a substrate, an electronic ink layer, a cover plate, at least one water vapor barrier and a sealant is provided. The electronic ink layer is disposed on the substrate. The cover plate covers the electronic ink layer, wherein the electronic ink layer is located between the substrate and the cover plate, and a groove is defined by a lower surface of the cover plate, a side surface of the electronic ink layer and an upper surface of the substrate. The at least one water vapor barrier is disposed in the groove. The sealant is filled into the groove to cover the at least one water vapor barrier.
Claims5
An electronic paper package structure, comprising:
- a substrate;
- an electronic ink layer having four corners, disposed on the substrate;
- a cover plate configured to cover the electronic ink layer, wherein the electronic ink layer is located between the substrate and the cover plate, and a groove is defined by a lower surface of the cover plate, a side surface of the electronic ink layer and an upper surface of the substrate;
- a plurality of water vapor barriers disposed in the groove and protruding from a side surface of the cover plate;
- and
- a sealant that fills the groove to cover the water vapor barriers, wherein the groove comprises a first area and a second area, and the water vapor barriers are only disposed in the first area of the groove, the first area corresponding to the four corners of the electronic ink layer.
Dependencies are inferred from the claim text.