Photonics integration in semiconductor packages

A semiconductor device comprising:

• a substrate comprising an interposer, the interposer comprising a first side and a second side, the substrate comprising a first layer, a core layer, and a second layer, the first layer being positioned on the first side, the second layer being positioned on the second side, and the core layer being positioned between the first layer and the second layer;
• an optical module coupled to the substrate, the optical module comprising a photonic integrated circuit (PIC) and electronic integrated circuit (EIC), wherein the EIC is coupled to the PIC via the substrate, and the PIC is embedded within the core layer;
• and
• a fiber optic coupler coupled to at least one of the substrate or PIC, wherein the PIC is configured to transmit or receive an optical signal via the fiber optic coupler.

A method comprising:

• coupling a photonic integrated circuit (PIC) of an optical module to a substrate, wherein the substrate comprises a first side and a second side, the substrate comprises a first layer, a core layer, and a second layer, the first layer is positioned on the first side, the second layer is positioned on the second side, and the core layer is positioned between the first layer and the second layer, the photonic integrated circuit is at least partially embedded within the core layer;
• coupling one or more fiber optic couplers to the substrate, wherein the fiber optic coupler is configured to allow the PIC to transmit or receive an optical signal via the fiber optic coupler;
• and
• bonding an electronic integrated circuit (EIC) of the optical module to the substrate, the substrate comprising one or more first routing layers.