High speed network device with orthogonal pluggable optics modules

A switch card assembly comprising:

• a switch printed circuit board (PCB);
• at least one switch chip mounted on the Switch PCB;
• a plurality of optical module connectors are mounted on the Switch PCB within a periphery of the Switch PCB, each optical module connector (“connector”) having an airflow channel between a first end of the connector and a back end of the connector, wherein an area of the Switch PCB on which the connector is mounted includes a corresponding cutout substantially aligned with the airflow channel at the back end of the connector;
• a heat dissipator disposed at the periphery of the Switch PCB;
• and
• the Switch PCB having a plurality of PCB traces that electrically connect the at least one switch chip to the plurality of optical module connectors,
• wherein the first ends of the optical module connectors and a first end of the heat dissipator are in spaced apart relation along a plane parallel to the Switch PCB, wherein when the first ends of the optical module connectors and the first end of the heat dissipator are exposed to an ambient airflow, a first portion of the ambient airflow enters the first ends of the optical module connectors, and a second portion of the ambient airflow that is separate from the first portion enters the first end of the heat dissipator.

A network switch comprising:

• an enclosure comprising a housing and a front panel;
• a switch card assembly vertically arranged within the housing in parallel relation to the front panel;
• and
• a fan unit configured to create a flow of ambient air (airflow) that enters through the front panel to cool components of the switch card assembly, and exits a rear vent on the housing,
• the switch card assembly comprising:
• a switch printed circuit board (PCB);
• at least one switch chip mounted on the Switch PCB;
• a plurality of connectors mounted within a periphery of and on the Switch PCB and oriented to receive optical modules along a direction perpendicular to the Switch PCB, each connector having an airflow channel between a front end of the connector and a back end of the connector, wherein an area of the Switch PCB on which the connector is mounted includes a corresponding airflow cutout substantially aligned with the airflow channel at the back end of the connector;
• PCB traces that electrically connect the at least one switch chip to the plurality of connectors, such that the at least one switch chip is electrically connected to the optical modules when the optical modules are received among the plurality of connectors;
• and
• a heatsink assembly comprising a heat collector coupled to a heat dissipator, the heat collector in thermal contact with the at least one switch chip, the heat dissipator disposed at the periphery of the Switch PCB,
• the front panel having a plurality of cutouts substantially in alignment with the plurality of connectors and an air mesh substantially in alignment with the heat dissipator,
• wherein the airflow comprises a first portion that flows through the plurality of cutouts and into the plurality of connectors and a second portion separate from the first portion that flows through the air mesh and into the heat dissipator.